Intergraph(R) Discovery Tour on July 4 in Zagreb, Croatia to Feature CADWorx(R) Plant and P&ID Professional With Integration of CAESAR II(R) and PV Elite(R)

HOUSTON, TX -- (MARKET WIRE) -- Jun 14, 2011 -- Intergraph has scheduled a Discovery Tour event on July 4, 2011 in Zagreb, Croatia that will feature Intergraph CADWorx Plant Professional and CADWorx P&ID Professional and demonstrations of how they integrate with Intergraph CAESAR II for pipe stress analysis and PV Elite for vessel and exchanger analysis. The presentation will highlight how this productivity-enhancing integration breaks down barriers between engineering and design so that both groups can share information seamlessly in a collaborative work environment. Hosting this event locally will be Intergraph reseller PIPETECH.

To register for the event, visit http://icas.intergraph.com/forms/ICAS-Discovery-tour-2011. For information on PIPETECH, visit http://www.pipetech.ch/. For information on Intergraph CADWorx, visit http://www.intergraph.com/products/ppm/cadworx/. For information on Intergraph's analysis products visit http://www.intergraph.com/ppm/analysis.aspx.

About Intergraph CADWorx & Analysis Solutions
The Intergraph CADWorx & Analysis Solutions (CAS) products allow design and engineering to share relevant information seamlessly, thereby maintaining accuracy and improving efficiency. They include CADWorx Plant Design Suite for AutoCAD®-based intelligent plant design modeling, process schematics and automatic production of plant design deliverables; CAESAR II, the world's most widely used pipe stress analysis software; PV Elite for vessel and exchanger design and analysis; and TANK for the design and analysis of oil storage tanks. For information on Intergraph CAS, visit www.coade.com.

Intergraph, the Intergraph logo, CADWorx, CAESAR II and PV Elite are registered trademarks, and TANK is a trademark of Intergraph Corporation. Other brands and product names are trademarks of their respective owners. © 2011 Intergraph Corp. All rights reserved.

 

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