Toshiba Memory America Adds BiCS FLASH to Lineup of e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products

SAN JOSE, Calif. — (BUSINESS WIRE) — February 26, 2019Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced that it will begin sampling new JEDEC e-MMC[1] Ver. 5.1[2] compliant embedded flash memory products for consumer applications next month. The new products integrate the company’s BiCS FLASH™ 3D flash memory and a controller in a single package.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190226005459/en/

New e-MMC products from Toshiba Memory America integrate the company's BiCS FLASH 3D flash memory an ...

New e-MMC products from Toshiba Memory America integrate the company's BiCS FLASH 3D flash memory and a controller in a single package. (Photo: Business Wire)

The company will continue to reinforce its market-leading position by delivering a broad, high-performance product lineup, including for applications that continue to need e-MMC as an embedded memory solution.

“e-MMC remains an important solution for many applications,” noted Scott Beekman, director of managed flash memory products for Toshiba Memory America, Inc. “Our e-MMC products with BiCS FLASH 3D flash memory will enable these applications to continue to have access to the latest flash technology.”

Key Specifications

Interface    

JEDEC e-MMC V5.1 standard
HS-MMC interface

Density[3]     16GB, 32GB, 64GB, 128GB
Power Supply Voltage     2.7V to 3.6V (Memory core)
1.7V to 1.95V (Interface)
Bus Width     ×1 / ×4 / ×8
Temperature Range     -25℃ to +85℃
Package     153Ball FBGA
11.5mm × 13.0mm
   

New Product Lineup

Product Name

    Capacity [3]     Package     Mass Production
THGAMRG7T13BAIL     16GB     11.5×13.0×0.8mm     3Q, 2019 (Jul.-Sep.)
THGAMRG8T13BAIL     32GB     11.5×13.0×0.8mm     3Q, 2019 (Jul.-Sep.)
THGAMRG9T23BAIL     64GB     11.5×13.0×0.8mm     3Q, 2019 (Jul.-Sep.)
THGAMRT0T43BAIR     128GB     11.5×13.0×1.0mm     3Q, 2019 (Jul.-Sep.)
           

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