Atotech product experts to present at SEMICON Europa and electronica 2018

BERLIN, November 9, 2018:  Atotech Group, a leading chemical and equipment supplier for PCB, semiconductor advanced packaging and dual damascene applications, will exhibit and present its latest products for power, automotive, and mobile semiconductor applications at this year’s SEMICON Europa. Atotech’s Semiconductor portfolio includes RDL and pillar plating solutions for next generation FOWLP and 5G applications as well as solutions for electroless pad metallization and double side plating for power semiconductors.

Image left: Plating fine lines, Cu pads
Image right: Microvia filling, CD ≤ 20 μm

SEMICON Europa is the largest and most influential gathering for the semiconductor industry in Europe and attracts more thought leaders from overseas every year. This year the SEMICON show will be co-located with electronica, an equivalently important show for the printed circuit board and electronics assembly industry. Both events take place in Munich, Germany, from November 13 to 16, 2018. While Hall A4 will be dedicated to SEMICON Europa, Hall B5 will feature electronica.

Atotech’s product experts will be present at booth 569 in Hall A4 to discuss latest technology, trends, and future requirements. This year’s product features include:

  • Spherolyte® Cu UF3 - High purity ECD copper process for fine line RDL plating and microvia filling capability
  • Spherolyte® Cu VR - Electrochemical copper process for fine line plating and simultaneous filling of various via dimensions
  • Xenolyte® Ni TR - A high-temperature resistant electroless nickel process for RDL and pad metallization
  • Spherolyte®Cu MD2 and MultiPlate® - A new low stress ECD copper process for power semiconductors that is developed to run in Atotech's next generation semiconductor plating tool: MultiPlate®

Atotech experts will also participate in the adjacent program with several presentations: 

  • On  Tuesday, Nov. 13, at 4:40 pm, Ulrich Memmert, Senior Scientist Material Sciences, will talk about “ Mechanical properties of copper for advanced packaging” at the Strategic Materials Conference in Room 14a  

  • On  Wednesday, Nov. 14, at 12:55 pm, Ralf Schmidt, R&D Manager Semiconductor, will introduce the audience to the “ Enhanced mechanical properties of copper for Fan Out Wafer Level Packaging applications” at the Advanced Packaging Conference in Room 13b 

  • On  Thursday, Nov. 15, at 10:45 am, Markus Hoerburger, Global Product Manager Semiconductor & Functional Electronics Coatings, will talk about “ Optimized Cu plating solution for next generation packaging" at the TechLounge on the Showfloor show floor in Hall A4

  • Also on  Thursday, Nov. 15, at 4:35 pm, Andreas Walter, Team Manager Semiconductor Electroless Processes, will discuss “ Electroless ternary nickel alloys for under bump metallization (UBM) on power semiconductors for high temperature process conditions or applications” at the TechArena 2, Hall A4

  • As part of the adjacent  electronica, Roger Massey, Technical Marketing Manager, will present “ Recent developments in advanced HDI PCBs” at the “PCB & Components marketplace” in Hall A1 on  Friday, Nov. 16, at 10:00 am.

Visitors to the show are invited to attend Atotech’s presentations and stop by at booth 569 in Hall A4 to discuss and elaborate on these and other topics and trends driving the industry.

About Atotech

Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.2 billion (2017). The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs about 4,000 people in over 40 countries.


Yvonne Fuetterer
Erasmusstr. 20
10553 Berlin, Germany
+49 30-349 85-220
Email Contact

Review Article Be the first to review this article
Featured Video
Latest Blog Posts
Alex Carrick, Chief Economist at ConstructConnectThe AEC Lens
by Alex Carrick, Chief Economist at ConstructConnect
From Within the Herd (June 1, 2020) – Word Processing vs Meat Processing
GIS Analyst #14713 for State of Missouri at Jefferson City,, Missouri
ROV Pilot II for TechnipFMC at Houston,, Texas
Geographic Information System Analyst II for State of Idaho at Boise, Idaho
Mechanical Designer for TechnipFMC at Houston,, Texas
Upcoming Events
BUILDINGSNY -postponed June 17-18, 2020 at Javits Center New York City NY - Jun 17 - 18, 2020
Urban Planning & Architectural Design for Sustainable Development – 5th Edition at Rome,Italy Roma Tre University Rome Italy - Jul 7 - 9, 2020
Cities’ Identity Through Architecture and Arts – 4th Edition at Rome,Italy Rome Italy - Jul 7 - 9, 2020
AEC Next Technology Expo + Conference (NEW DATE), at McCormick Place Chicago IL - Jul 27 - 29, 2020
Kenesto: 30 day trial
Context Capture - Countless CAD add-ons, plug-ins and more.

© 2020 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise