Xpeedic’s IRIS Certified for EM Simulation in GLOBALFOUNDRIES 22FDX Process

CUPERTINO, Calif. — (BUSINESS WIRE) — June 12, 2018 — Xpeedic Technology, Inc. today announced that its 3D full-wave electromagnetic (EM) simulation tool, IRIS, has been certified in GLOBALFOUNDRIES' 22FDX® process technology. This certification enables designers to run IRIS with confidence using the certified IRIS process file available in GF’s 22FDX PDK.

Xpeedic’s IRIS is empowered by an accelerated Method of Moments solver engine to achieve both accuracy and scalability for large-scale structures. For advanced nodes, it takes into account the width- and spacing-dependent process variations such as resistance table and bias table. As a result, IRIS is able to capture the conductor skin effect and proximity effect to accurately simulate passive components like inductors and MOM (metal-oxide-metal) capacitors. Xpeedic has done extensive simulation on various inductors and MOM capacitors with different process stack options. Excellent correlation with silicon measurement has been achieved.

"We are very pleased that IRIS is able to achieve excellent correlation with measurement and thus certified for GF’s 22FDX process," said Dr. Feng Ling, CEO of Xpeedic Technology. "With its powerful EM solver engine and seamless integration in design environment, IRIS can greatly help IC designers to shorten the design cycles and achieves first-pass silicon success."

The electromagnetic certification program by GF ensures that every EM tool certified by the program meets the highest quality standards. With this certification, IC designers can choose their preferred EM simulation tool and its corresponding process file to ensure their design confidence and reduce time-to-market.

About Xpeedic

Xpeedic Technology, Inc. is a leading provider of EDA solutions for IC, package and system designs. The analog/mixed-signal IC tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. These tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

Founded in 2010, Xpeedic has offices in both the US and China. For more information, please visit www.xpeedic.com.



Contact:

Xpeedic PR Contact
Max Cang, +86 18621559611
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