Toshiba Expands Line-up of Industrial Grade e∙MMC™ Ver. 5.1 Compliant Embedded NAND Flash Memory Products

-- Operating temperature range enhanced to +105°C --

TOKYO — (BUSINESS WIRE) — December 20, 2016Toshiba Corporation’s (TOKYO:6502) Storage & Electronic Devices Solutions Company today announced the launch of JEDEC e∙MMC™ Version 5.1[1] compliant embedded NAND flash memory products with an enhanced operational temperature range of -40°C to +105°C. The new products integrate NAND chips fabricated with 15nm process technology and are designed for industrial applications, including PLC[2], CoMs[3] and factory automation equipment, and can also be used in a wide range of consumer applications. The line-up offers densities of 8GB, 16GB, 32GB and 64GB. Sample shipments start from today, with mass production scheduled for March 2017.

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Toshiba: Industrial grade e-MMC embedded NAND flash memory product with an enhanced operational temp ...

Toshiba: Industrial grade e-MMC embedded NAND flash memory product with an enhanced operational temperature range of -40 degrees Celsius to +105 degrees Celsius (Photo: Business Wire)

The new products integrate NAND chips with a controller to manage basic control functions for NAND applications in a single package. As a complement to Toshiba’s current industrial product group of e∙MMC, which have an operating temperature range of -40 to +85°C, the new e∙MMC product family support applications that require e∙MMC storage solutions to operate at higher temperatures, up to +105°C. This enhanced range offers users more freedom of choice in developing memory solutions for industrial applications in high temperature environments.

In the consumer and industrial market, demand for e∙MMC with high temperature support continues to grow, for applications requiring higher performance and higher power consumption. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products and will continue to take leadership in the market.

 

New Product Line-up

Part Number   Capacity   Temperature Range   Package
THGBMHG6C1LBAU6 8GB -40℃~+105℃ 11.5x13x0.8mm
THGBMHG7C2LBAU7 16GB -40℃~+105℃ 11.5x13x1.0mm
THGBMHG8C4LBAU7 32GB -40℃~+105℃ 11.5x13x1.0mm
THGBMHG9C8LBAU8   64GB   -40℃~+105℃   11.5x13x1.2mm
 

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