Toshiba Expands Line-up of Embedded NAND Flash Memory Products for Automotive Applications

- Supports AEC-Q100 Grade2 Requirements -

TOKYO — (BUSINESS WIRE) — December 20, 2016Toshiba Corporation’s (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of JEDEC e∙MMCTM Version 5.1[1] compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 [2] requirements. The line-up offers densities of 8GB, 16GB, 32GB and 64GB. Sample shipments start from today with mass production scheduled for the second quarter (April to June) of 2017.

This Smart News Release features multimedia. View the full release here: http://www.businesswire.com/news/home/20161220005388/en/

Toshiba: e-MMC embedded NAND flash memory product for automotive applications supporting AEC-Q100 Gr ...

Toshiba: e-MMC embedded NAND flash memory product for automotive applications supporting AEC-Q100 Grade2 requirements (Photo: Business Wire)

The new products integrate NAND chips fabricated with 15nm process technology with a controller to manage basic control functions for NAND applications in a single package. As a complement to Toshiba’s previous product group of e∙MMC, which deliver the operating temperature range of -40 to +85°C required by car infotainment applications, the new products support applications such as instrument clusters that require e∙MMC storage solutions to operate at higher temperatures up to +105°C.

In the automotive market, demand for NAND flash memory is continuing to grow alongside advances in car infotainment, ADAS [3] and autonomous driving systems. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products and will continue to take leadership in the market.

Toshiba is also developing automotive UFS [4] products that support AEC-Q100.

 

New Product Line-up

 
Part Number   Capacity   Temperature Range   Package
THGBMHG6C1LBAB6 8GB

-40℃ to +105℃

11.5x13x0.8mm
THGBMHG7C2LBAB7 16GB

-40℃ to +105℃

11.5x13x1.0mm
THGBMHG8C4LBAB7 32GB

-40℃ to +105℃

11.5x13x1.0mm
THGBMHG9C8LBAB8   64GB  

-40℃ to +105℃

  11.5x13x1.2mm
 

1 | 2 | 3  Next Page »



Review Article Be the first to review this article


Featured Video
Latest Blog Posts
Alex Carrick, Chief Economist at ConstructConnectThe AEC Lens
by Alex Carrick, Chief Economist at ConstructConnect
U.S. & Canadian Economies Lifted by Fervent Swirl of Housing Starts
Jobs
Architectural Project Manager for SERA Architects, Inc at Oakland, California
Architectural Project Designer for SERA Architects, Inc at Oakland, California
Landscape Project Assist for SERA Architects, Inc at Oakland, California
Construction Sales Executive for Microdesk at Los Angeles, California
Senior Highway Engineer for RS&H at Jacksonville, Florida
Upcoming Events
AIBD, Design & Build Winter Conference at United States - Mar 17 - 19, 2021
DCW - Digital Construction Week at Excel London United Kingdom - May 19 - 20, 2021
World Architecture Festival at United States - Jun 23 - 25, 2021
ICSD 2021 : 9th International Conference on Sustainable Development, 8 - 9 September Rome, Italy at Roma Eventi, Pontifical Gregorian University Piazza della Pilotta, 4 Rome Rome Italy - Sep 8 - 9, 2021
Kenesto: 30 day trial
CADalog.com - Countless CAD add-ons, plug-ins and more.



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise