Functional safety and data protection features enable more complex SoCs that can meet stringent ISO 26262 standards
CAMPBELL, Calif. — Oct. 4, 2016 — Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that STMicroelectronics has licensed Arteris FlexNoC interconnect IP along with the FlexNoC Resilience Package.
ISO 26262 automotive safety integrity levels (ASIL) are classifications used to help define the requirements necessary for a system to be compliant with the ISO 26262 Functional Safety for Road Vehicles standard. The lowest ASIL is QM, meaning “Quality Management”, and denotes the need for no special safety measures, while the highest safety level, ASIL D, represents the safety level for systems where malfunction could lead to fatal life-threatening injury. The Arteris FlexNoC Resilience Package can be used to create SoCs that meet ISO 26262 ASIL D requirements. Arteris is a member of the U.S. Technical Advisory Group (TAG) to the ISO 26262 TC22/SC32/WG08 working group, helping create safety standards for semiconductors and semiconductor IP.
“We are proud that ST has chosen Arteris interconnect IP technology as the backbone for use in the next generation of automotive SoCs,” said K. Charles Janac, President and CEO of Arteris. “We look forward to working with ST to implement interconnect technologies such as resilience to meet automotive functional safety requirements.”
Arteris, Inc. provides
system-on-chip (SoC) interconnect IP and tools to accelerate SoC semiconductor assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as
Huawei / Hisilicon,
Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at
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