Leti Demos MEMS Fabrication on its 300mm Line, Pointing the Way to Lower Manufacturing Costs

GRENOBLE, France — (BUSINESS WIRE) — September 17, 2015 — In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.

“With more than 200 people involved on micro-systems R&D, Leti is one of the world’s leading research institutes on MEMS, and this demonstration that our 200mm MEMS platform is now compatible with 300mm wafer fabrication shows a significant opportunity to cut MEMS production costs,” said Leti CEO Marie Semeria. “This will be especially important with the worldwide expansion of the Internet of Things and continued growing demand for MEMS in mobile devices.”

Leti is a pioneer and leader in MEMS research and development for sensors and actuators. Building on more than 30 years of MEMS R&D, Leti continues to focus on innovative sensor technologies.

The most advanced is its M&NEMS technology platform based on detection by piezo-resistive silicon nanowires, which reduce sensor size and improve performances of multi-axis sensors. Leti’s inertial-sensor manufacturing concept enables the design and fabrication of combo sensors, such as three-axis accelerometers, three-axis gyroscopes and three-axis magnetometers on the same chip. This is a key component for Internet of Things (IoT) applications.

Leti’s M&NEMS concept, developed with 200mm technology, is currently being transferred to an industrial partner. Demonstration of this technology on 300mm wafers has shown very promising results.

In addition to lowering costs, manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of 3D through-silicon-vias (TSV), which is already available in 300mm technology.

Jean-René Lèquepeys, head of Leti’s Silicon Components Division, will present the latest results in Leti’s MEMS technology R&D at the European MEMS Summit 2015, Sept. 17-18 in Milan, Italy.

For more about Leti, visit www.leti.fr/en

 



Contact:

CEA-Leti
Press contact
Agency
Sarah-Lyle Dampoux, +33 6 74 93 23 47
Email Contact

 




Review Article Be the first to review this article
Bentley:

Featured Video
Latest Blog Posts
Alex Carrick, Chief Economist at ConstructConnectThe AEC Lens
by Alex Carrick, Chief Economist at ConstructConnect
The Economy under COVID-19: Notes from the Trenches (40)
Jobs
Mechanical Designer for TechnipFMC at Houston,, Texas
GIS Analyst #14713 for State of Missouri at Jefferson City,, Missouri
Geographic Information System Analyst II for State of Idaho at Boise, Idaho
ROV Pilot II for TechnipFMC at Houston,, Texas
Upcoming Events
BUILDINGSNY -postponed June 17-18, 2020 at Javits Center New York City NY - Jun 17 - 18, 2020
Urban Planning & Architectural Design for Sustainable Development – 5th Edition at Rome,Italy Roma Tre University Rome Italy - Jul 7 - 9, 2020
Cities’ Identity Through Architecture and Arts – 4th Edition at Rome,Italy Rome Italy - Jul 7 - 9, 2020
AEC Next Technology Expo + Conference (NEW DATE), at McCormick Place Chicago IL - Jul 27 - 29, 2020
Kenesto: 30 day trial
Bentley: Livestream On Demand
CADalog.com - Countless CAD add-ons, plug-ins and more.



© 2020 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise