TOKYO — (BUSINESS WIRE) — January 31, 2014 — Toshiba Corporation (TOKYO:6502) today announced the launch of photorelays in the industry’s smallest package. Shipment of mass production products starts from today.
Toshiba: VSON (Very Small Outline Non-leaded) Package Photorelays (Photo: Business Wire)
The new products, “TLP3403” and “TLP3412”, utilize the industry’s smallest package for photocouplers, the Toshiba-developed VSON (Very Small Outline Non-leaded) package. Compared to equivalent Toshiba products in a USOP package, the new photorelays reduce the assembly area by 50% and volume by 60%. This can contribute to the development of smaller and thinner sets and also makes it possible to increase the number of photorelays on a circuit board to 1.3 times to 1.5 times that of conventional products.
Also, by using a new internal structure, a chip-on-chip structure, the new products, while retaining the same electrical characteristics as conventional USOP package products, secure improved high-frequency characteristics, which are necessary for signal transmission. The new photocouplers are suitable for various tester applications, especially for use in power-line switching and measuring-line switching.
Key Specifications of New Products
Area: 1.5 mm × 2.5 mm (max)
Height: 1.3 mm (max)
|On-state Current||1 A (max)||0.4 A (max)|
|On-state Resistance||0.18 Ω (typ), 0.22 Ω (max)||1 Ω (typ), 1.5 Ω (max)|
|Off-state Voltage||20 V (min)||60 V (min)|
|40 pF (typ)||20 pF (typ)|
|Trigger LED Current||3 mA (max)|
Equivalent Rise Time
|40 ps (typ)|
|Isolation Voltage||300 Vrms（min）|