Former Apple and Broadcom Executive, Dr. Edward H. Frank, Joins eASIC Board of Directors

Santa Clara, CA – November 25, 2013 – eASIC® Corporation, a leading provider of Single Mask Adaptable ASIC™ devices today announced the appointment of Dr. Edward H. Frank to the company’s Board of Directors. Dr. Frank was recently Vice President of Macintosh Hardware Systems Engineering at Apple, Inc. and currently serves on the board of directors for  Fusion-io, Inc.

“Ed’s strong and proven history of developing and bringing revolutionary solutions to market makes him an excellent addition to our board of directors”, said Ronnie Vasishta, president and CEO of eASIC. “His expertise in delivering innovative silicon and systems, at companies both large and small, will be invaluable as we continue to provide unique silicon customizations solution to our system customers.”

“Custom silicon is critical for developing innovative solutions”, said Dr. Frank. “But cost, engineering effort, and development time are major issues. eASIC’s proven Single Mask Adaptable ASIC dramatically reduces those impediments, creating unique and significant opportunities for eASIC customers. I am excited to be working with the eASIC team and leveraging my experience and expertise to further accelerate the company’s growth.”

Previously, Dr. Frank was the vice president of research and development at  Broadcom, following its acquisition of Epigram, Inc., a company he co-founded. Dr. Frank also co-founded  NetPower Inc. and held senior technology leadership positions at  Sun Microsystems Inc. He is a named inventor on over 50 patents and is a  Life Trustee of Carnegie Mellon University. Dr. Frank holds BSEE and MSEE degrees from  Stanford University and a Ph.D. in  Computer Science from Carnegie Mellon University.

About eASIC

eASIC is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.


Niall Battson
eASIC Corporation
(408) 855 9200
Email Contact 

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