TDK-EPC P8009 Module with Maxim Embedded Dies - Production/Cost Analysis Report

DUBLIN, November 19, 2013 — (PRNewswire) —

Research and Markets ( has announced the addition of the "TDK-EPC P8009 Module with Maxim Embedded Dies" report to their offering.

     (Logo: )

Key Features of this TDK-EPC P8009 Module with Maxim Embedded Dies report.

  • One of the few high volume 3D embedded dies package
  • Latest evolution of the TDK SESUB Process

The embedded die process of TDK-EPC, called SESUB (Semiconductor embedded in SUBstrate), is an innovative packaging technology based on the emerging embedded die in laminate substrate concept where all of the package assembly operations are done at the panel-scale level. A 4-layer 3D interconnection routing path with 20µm minimum line width is provided. This technology extends the package size beyond the ICs surface area and allows for mounting additional passives components on top of the laminated module.

With this packaging approach, TDK considerably changed the conventional supply chain model, where the chip maker sells directly to the system maker. Here the module maker is taking a larger role by adding considerable value.

This report provides a complete teardown of the embedded dies package with:

Detailed photos & Material analysis

  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Exhaustive cost breakdown and selling price estimation

Key Topics Covered:

  1. Glossary
  2. Overview/Introduction
  3. Companies Profile
  4. P8009 Characteristics & Supply Chain
  5. P8009 Physical Analysis
  6. Manufacturing Process Flow
  7. Cost Analysis

For more information visit

Research and Markets
Laura Wood, Senior Manager
Email Contact
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Advanced Technology

SOURCE Research and Markets

Research and Markets

Review Article Be the first to review this article
Featured Video
Latest Blog Posts
Alex Carrick, Chief Economist at ConstructConnectThe AEC Lens
by Alex Carrick, Chief Economist at ConstructConnect
12 Mid-January Economic Nuggets
VectorworksVectorworks Blog
by Vectorworks
You’re Probably Doing BIM Without Knowing It!
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Mid-Level Landscape Architect/Designer for Studio-MLA at Los Angeles, California
GIS Specialist for City of Ithaca at ithaca, New York
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
GIS Specialist- GIS & Data Services for County of Macomb - GIS & Data Services at Mount Clemens, Michigan
Upcoming Events
Digital Built Week Americas at Anaheim CA - Jun 14, 2022 - Dec 31, 1969
Utopian and Sacred Architecture Studies (USAS) - 2nd Edition at University Way, Dockland Campus London, E16 2RD, UK London --Choose One-- United Kingdom - Jun 14 - 15, 2022
HxGN LIVE Global 2022 - Future of Manufacturing at Las Vegas NV - Jun 20 - 23, 2022

© 2022 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise